Abstract
WireElectro Discharge Machining (Wire-EDM) trim cut operations are performed to reduce the thickness of the thermally influenced zone. Mechanically high demanding applications like flexure hinges with high precision positioning tasks need exact knowledge about the level of thermal damage in the workpiece. Electron Backscatter Diffraction (EBSD) is used for a comprehensive characterization of the rim zone. Especially grain sizes and local crystal orientations can be analyzed in detail. By fundamentally correlating the local crystal orientation with the residual stress distributionsfrom standardX-ray stress measurements for Wire-EDM operations, it will be possible in future to determine locally the thicknesses of the process induced damaged or altered layers with high resolution. This information can then be used to optimize the flexure hinge precision movement kinematics.
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