Abstract
This paper discusses the early design analysis of large computer systems and presents techniques and models for evaluating the matching between a proposed machine design and an MCM packaging technology. It shows that an early design specification, coupled with a prediction tool, can provide valuable insight into limitations and specific design problem areas, which often only becomes apparent much later in the product cycle. A detailed discussion of the tradeoff between machine performance and package specifications is given along with the details of an interactive early analysis methodology. Detailed models are presented for the early analysis of transmission line constraints, chip placement and coupled noise.
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