Abstract
Our purpose is to develop miniaturized heat rejection system that can dissipate more than 100W/cm^2. In the evaporator, thin liquid film vaporization which can dissipate very high heat flux, was utilized. The liquid film is stabilized in micro-channels by capillary forces. The micro-channels are fabricated by chemical etching on copper plate. Also miniaturized condenser which utilized droplet condensation was tested. Droplets were produced on a cooled plate covered by non-wetting coating. After we built a heat rejection system constructed by above mentioned evaporator and condenser, influence of heat flux, coolant flow rate, and inlet temperature on the temperature of the heater element were investigated. Water is used as working fluid. Heat flux of 100W/cm^2 could be achieved for water inlet temperature in flow rate of 3.0mL/min. The temperature of the heater element is kept constant at about 120℃. The measured pressure drop is less than 1000Pa.
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