Abstract

The kinetics of gold electrodeposit roughening was studied at the nanometer level by scanning tunneling microscopy (STM) and by using dynamic-scaling theory. Gold electrodeposits were grown at 100 nm ${\mathrm{s}}^{\mathrm{\ensuremath{-}}1}$ from the electroreduction of hydrous gold oxide layers. The following dynamic-scaling exponents were obtained: \ensuremath{\alpha}(I)=0.90\ifmmode\pm\else\textpm\fi{}0.06 and \ensuremath{\beta}(I)=0.31\ifmmode\pm\else\textpm\fi{}0.08 for ${\mathit{L}}_{\mathit{s}}$${\mathit{L}}_{\mathrm{sc}}$, and \ensuremath{\alpha}(II)=0.49\ifmmode\pm\else\textpm\fi{}0.05 and \ensuremath{\beta}(II)=0.51\ifmmode\pm\else\textpm\fi{}0.08 for ${\mathit{L}}_{\mathit{s}}$>${\mathit{L}}_{\mathrm{sc}}$, where ${\mathit{L}}_{\mathit{s}}$ is the scale length, and ${\mathit{L}}_{\mathrm{sc}}$ is a critical length closely related to the average grain size of the electrodeposit measured from STM imaging. Results from dynamic-scaling analysis are consistent with a grain surface smoothing mechanism involving surface diffusion of gold atoms.

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