Dynamic recrystallization behaviour at grain boundaries and triple junctions

Abstract

Dynamic recrystallization (DRX) behaviour and nucleation mechanisms were investigated using copper and copper alloy bicrystals, tricrystals and polycrystals. New grains were preferentially formed along grain boundaries in the bicrystals. After grain-boundary migration and bulging, nuclei appeared behind the deeply bulged grain boundary regions. The critical strain for nucleation was about one-quarter to one-half of the peak strain. The characteristics of nucleation at a grain boundary depended sensitively on grain boundary character. In copper alloy bicrystals, nucleation was much delayed due to solute drag of migrating grain boundaries. The nucleation at triple junctions, in contrast, took place at a much lower strain. New grain formation at triple junction was stimulated by development of folds. All the new grains were twin-related (Σ3) to the matrix and were formed behind the migrating grain boundaries. Therefore, it was revealed that the DRX mechanism in copper and copper alloys was essentially controlled by annealing twin formation. Variant selection of the twinning plane depended sensitively on the direction of the grain-boundary migration and on the geometry, however, was not affected by activated slip plane or dislocation glide. The DRX nucleation mechanisms at grain boundaries and at triple junctions are discussed with respect to grainboundary migration and annealing twin formation.