Dynamic power and thermal integrity in 3D integration

Abstract

This paper presents a state-of-art advance in 3D integrations. It illustrates the need for a high-performance 3D design driven by dynamic power and thermal integrity. The through-silicon-via (TSV) is used to simultaneously deliver power supply and remove heat. More importantly, to cope with the large-scale design complexity, the modern macromodeling technique is applied to handle not only large numbers of dynamic inputs/working-loads but also large sizes of RLC/RC networks distributing the power/heat. Experiments applying the 3D design presented by this paper showed promising results to reduce both runtime and resource.