Dynamic mismatch between bonded dissimilar materials

Abstract

In the bonding of dissimilar materials, the coefficient of thermal expansion (CTE) relates to only the static or thermal equilibrium case, and does not represent most actual conditions (i.e., the service and processing temperatures are usually changing rather than fixed). This article outlines an approach that computes the effective, or dynamic, CTE mismatch. This dynamic mismatch varies with the bonded material shapes and sizes, surface characteristics, and heating or cooling conditions and times and may be several times greater than the corresponding static CTE mismatch. Unrelieved, the computed transient or dynamic thermal-strain mismatch may exceed the yield point of the metal, while the transient or dynamic mismatch stress often exceeds the flexural or compressive strength of the ceramic. Understanding transient mismatch phenomena has led to new, unmatched metal-ceramic joints that withstand repeated, rapid thermal shocks and subsequent severe mechanical shocks. The final forced fractures occur outside the bonded regions, indicating defect free joints.