Abstract
AbstractThe dynamic mechanical properties and the adhesive strengths of epoxy resins‐CTBN blend systems and epoxy resins‐CTBNX blend systems were investigated.Both CTBN blend and CTBNX blend systems were proved to be partially compatible with the dynamic mechanical measurement. In the case of CTBN blend systems, the more blending of CTBN, the more the compatibility increased. On the other hand, CTBNX‐20 was more compatible than CTBNX‐30 but less than CTBNX‐40. In any case, the blending of CTBN or CTBNX reduced the nonreacted part of the epoxy resins cured at room temperature.The adhesive strengths were evaluated as a function of the storage modulus with altering temperature and altering rubber content. Both procedures were proved to be equal.
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