DYNAMIC CRACK PROPAGATION IN A FUNCTIONALLY GRADED PIEZOELECTRIC INTERFACE LAYER BETWEEN TWO DISSIMILAR PIEZOELECTRIC LAYERS UNDER ELECTROMECHANICAL LOADING

Abstract

The dynamic propagation of a crack in a functionally graded piezoelectric material (FGPM) interface layer between two dissimilar piezoelectric layers under anti-plane shear is analyzed using the integral transform approaches. The properties of the FGPM layers vary continuously along the thickness. FGPM layer and the two homogeneous piezoelectric layers are connected weak-discontinuously. A constant velocity Yoffe-type moving crack is considered. Numerical values on the dynamic energy release rate (DERR) are presented for the FGPM. Followings are helpful to increase of the resistance of the crack propagation of the FGPM interface layer: (a) certain direction and magnitude of the electric loading; (b) increase of the thickness of the FGPM interface layer; (c) increase of the thickness of the homogeneous piezoelectric layer which has larger material properties than those of the crack plane in the FGPM interface layer. The DERR always increases with the increase of crack moving velocity and the gradient of the material properties.