Abstract
This paper investigates the dynamic behavior of functionally graded beam in the thermal environment due to a moving harmonic load. The material properties are assumed to be graded in the thickness direction by a power-law function, and they are considered to be temperature dependent. Two types of temperature distribution, namely uniform and nonlinear temperature rises, are considered. Equations of motion based on Euler-Bernoulli beam theoryare derived from Hamilton’s principle and they are solved by a simple finite element formulation in combination with Newmark time-integration procedure. Numerical results show that the dynamic deflection and dynamic amplification factor is decreased with increasing the temperature rise, and the decreasein the uniform temperature rise is more significant that by the nonlinear temperature rise. The excitation frequency plays an important role in the dynamic behavior of the beams, and the frequency at which resonant phenomenon can occur depends on the temperature. A parametric study is carried out to highlight the effect of the temperature rise and moving load parameters on the dynamic behavior of the beams.
Highlights
Graded materials (FGMs) were firstly developed by a Japanese scientist in mid-1980s as structural components for using in severe thermal conditions [1]
To the authors' best knowledge, the dynamic behavior of Functionally graded materials (FGMs) beams in the thermal environment due to a moving harmonic load has not been studied in the literature, and it will beconsidered in the present work
AnFGM beam formed fromAl2O3 and SUS304 with the materials data given in Table 1 under a moving harmonic load F=F0cos (Ωt) with F0=100 kN is considered here with
Summary
Graded materials (FGMs) were firstly developed by a Japanese scientist in mid-1980s as structural components for using in severe thermal conditions [1]. To the authors' best knowledge, the dynamic behavior of FGM beams in the thermal environment due to a moving harmonic load has not been studied in the literature, and it will beconsidered in the present work.
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More From: International Journal of Mechanical Systems Engineering
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