Abstract
The problem of dynamically debonded cylindrical inclusion near the interface of semi-infinite piezoelectric materials was theoretically investigated. The effects of different geometric and physical parameters on the dynamic stress intensity factor (DSIF) of the crack tip are discussed. The theoretical expressions for the crack (debonding) DSIF were obtained using methods that included Green’s function, the complex variable function, and multipolar coordinates, and the numerical results showed that the dynamic characteristics of the debonded structure were more obvious under conditions of low frequency and large piezoelectric characteristic parameters. In addition, the period of the DSIF at the crack tip became shorter as the incident wave number increased. There are, therefore, important theoretical and engineering considerations for the dynamic analysis of piezoelectric materials with debonded cylindrical inclusion.
Highlights
Due to the electromechanical coupling effect, piezoelectric materials are widely used in intelligent structures and sensor elements to realize the self-diagnosis and self-repair of structures
Feng et al.4 used the wave function expansion and singular integral equation methods to study the scattering of SH waves by partially debonded cylindrical inclusions, and Song et al.5 used the complex function and wave function expansion methods to study the scattering and dynamic stress concentration of steady SH waves in an infinite linear elastic piezoelectric medium with rigid movable cylindrical inclusions
The purpose of the present paper is to suggest an effective theoretical method for solving the problem of dynamic debonded cylindrical inclusions near the interface of semi-infinite piezoelectric materials
Summary
Due to the electromechanical coupling effect, piezoelectric materials are widely used in intelligent structures and sensor elements to realize the self-diagnosis and self-repair of structures. Chen et al. solved the dynamic stress concentration problem of a circular hole and a cylindrical inclusion in an elastic half-space under the action of SH waves using the complex function and wave function expansion methods. Yang et al. solved the scattering of SH waves by a single elliptical hole and crack on the same side near the interface of biphasic media using Green’s function and conformal mapping methods. In order to investigate piezoelectric materials with a doubly periodic array of cracks and rigid-line inclusions under a farfield anti-plane mechanical load and an in-plane electric load, the conformal mapping technique and elliptical function theory were used by Xiao et al.. The purpose of the present paper is to suggest an effective theoretical method for solving the problem of dynamic debonded cylindrical inclusions near the interface of semi-infinite piezoelectric materials
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