Abstract
This study investigates experimentally and numerically the influences of FOUP door opening speed (Vdoor) and the pressure difference (dP) on the dynamic distributions of the averaged non-dimensional particle concentration in the FOUP (Cave), which is defined as averaged particle concentration in the FOUP (cave) divided by the particle concentration in the clean room (cCR). Here dP is the difference between the mini-environment pressure and the clean-room pressure. Results show that when Vdoor lies between 0.05 m/s~0.15 m/s and dP within 0.3 Pa-12.7 Pa, Cave proportional to 1/2ρVdoor2 and inversely proportional to dP. This can be expressed by a stepwise multiple regression equation: Cave = 4.56 × 10-1 (1/2ρVdoor2) – 4.6 × 10-4 dP + 4.96 × 10-3.
Highlights
In line with improvement in production techniques, the rise in the number of 300 mm wafer manufacturing factories is a natural trend
As opposed to factories producing the smaller 200 mm wafer, these factories use wafer loading/unloading modules with FOUP/Load Port Unit (LPU) combined with mini-environment
A high Vdoor case corresponding to a high peak value of concentration at the wafer surface (Cwafer)
Summary
In line with improvement in production techniques, the rise in the number of 300 mm wafer manufacturing factories is a natural trend. As opposed to factories producing the smaller 200 mm wafer, these factories use wafer loading/unloading modules with FOUP/LPU combined with mini-environment. Their main functions are detailed as follow. Mini-environment Mini-environment is a small-scale clean environmental mechanism housing the entire wafer production facilities to ensure that the processing of wafer is carried out in a controllable high level of cleanliness. Each production tool has its individual minienvironment whose clean air is provided by a FFU
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