Ductility of thin copper films on rough polymer substrates

Abstract

Electronic components in modern flexible electronics are connected by interconnects, which typically have the form of metal films resting on polymer substrates. This paper firstly studies experimentally the ductility of Cu films deposited on polyimide substrate with roughened surface (due to sandblasting) and finds that, upon tensile loading along the direction of film surface, the density of surface cracks in the film decreases with increasing surface roughness. The method of finite elements is subsequently employed to study the distribution of tensile stresses in the film and their influence on film cracking (initiation and propagation). It is demonstrated that a rough (curved) interface can reduce the tensile stresses along the film surface so as to restrain channel cracking of the film. Finally, the cohesive zone model is used to study the initiation and spreading of damage in the film and interfacial debonding of the curved interface. Both the interfacial damage and interface crack length are reduced as a result of interface roughening.