Abstract

Increasing heat flux restricts the development of the miniaturization of electronic devices. There is an urgent need for a heat dissipation method that will efficiently cool the chip. This paper presents a novel liquid cooling device based on dual synthetic jets actuator (DSJA) technology. The characteristics of the temperature and velocity field of the device are numerically studied by a three-dimensional coupled heat transfer model. The entropy generation rate caused by heat transfer and fluid friction was studied to analyze the effective work loss and irreversibility of the heat transfer process. When the DSJA is turned on, the temperature of the heat source with a heat flux of 200 W/cm2 is 73.07 ∘C, and the maximum velocity is 24.32 m/s. Compared with the condition when the the DSJA is closed, the temperature decreases by 25.15 ∘C, and the velocity increases by nearly 20 m/s. At this time, the total inlet flow is 1.26 L/min. The larger frictional entropy generation is mainly distributed near the inlet and outlet of the channel and the jet orifice. The higher the velocity is, the more obvious the frictional entropy generation is. Due to the large temperature gradient, there is a large thermal entropy generation rate at the fluid–solid interface.

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