Dual-Metal-Gate Transistors with Symmetrical Threshold Voltages Using Work-Function-Tuned Ta/Mo Bilayer Metal Gates

Abstract

We have investigated dual-work-function metal gates based on Mo and stacked Ta/Mo fabricated by an interdiffusion method that does not require a metal etching process from the gate dielectrics. The diffusion of Ta into the Mo layer provides a markedly reduced work function for the Ta/Mo gate (4.42 eV) in comparison with that for the single Mo gate (5.04 eV). The metal–oxide–semiconductor field-effect transistors (MOSFETs) with the Mo and Ta/Mo gates on 4-nm-thick SiO2 were fabricated by the gate-first process with dopant activation annealing at 850 °C. The Ta/Mo-gate n-MOSFET with the reduced gate work function and the Mo-gate p-MOSFET exhibited almost symmetrical threshold voltages (+0.53/-0.45 V). It was also confirmed that the Ta/Mo interdiffusion process did not degrade the gate dielectric integrity and electron mobility in contrast to the case of the single Mo gate.