Abstract
In recent years, the pulsed sputtering technique has gained a firm hold as a process. The use of this technique opens up a lot of opportunities, especially for the reactive deposition of compound layers. High deposition rates and stable coating conditions are attainable over a very long time. Here we present dual magnetron sputter (DMS) systems with a target length of up to 3600 mm and sine-wave generators with a plasma power of up to 100 kW. We discuss the problems of impedance matching between the generator and the plasma discharge, and give the deposition rates attained and some important process parameters for the deposition of SnO 2, TiO 2 and SiO 2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.