Dual‐band MIMO antenna decoupling using vias based multipath decoupling circuit

Abstract

AbstractThis article offers a new decoupling circuit for isolation enhancement to decouple the dual‐band multiple‐input‐multiple‐output (MIMO) antenna in a compact dimension. In the design, a novel dual‐band vias‐based stub‐loaded multipath decoupling circuit is used which offers multipath decoupling using admittance parameters of the structure to enhance isolation. The vias position transforms the stub's behavior into a mix of inductive and capacitive behavior, and its diameter variation aids in isolation and frequency fine‐tuning. The proposed multipath decoupling circuit helps to achieve good isolation between the antenna element using a hybrid coupling. The projected MIMO antenna radiates at 2.29–2.51 GHz (Wi‐Fi) and 5.74–5.89 GHz (WLAN) bands simultaneously to validate the proposed decoupling circuit's effectiveness and demonstrate the design procedure. The decoupling circuit helps obtain the isolation more significant than 20 dB in each band than the initial 11 dB in the Wi‐Fi band and 14 dB in the WLAN band. Moreover, the proposed decoupling scheme can be helpful for the redesign of other multi‐band MIMO antennas applications. The excellent diversity performance, which makes this a suitable contender for advanced technological systems.