Dual band adaptive focal plane array: an example of the challenge and potential of intelligent integrated microsystems

Abstract

Creating intelligent integrated microsystems, devices that incorporate photonics, electronics, MEMS, and embedded intelligence, presents multiple challenges. The three device technologies have been largely developed independently and have established their own sets of design and process rules that have led to highly stable, high yield processes. In combining these technologies to achieve a desired functionality, constraints are placed on each technology to avoid adverse impacts on the others. Finding a common path towards achieving a single end objective requires process reoptimization and the development of new processes. This paper discusses the dual band adaptive focal plane array (AFPA) that is currently under development, with an emphasis on technology integration and the resulting functional benefits that can be realized. The AFPA device is a dual band IR imaging sensor that enables simultaneous collection of high-resolution MWIR imagery, with spatially independent spectrally tuned imaging in the LWIR for enhanced target detection and classification.