Abstract
A surface micromachining fabrication scheme based on organic sacrificial layers and dry-release in oxygen plasma is presented. Free-standing metal structures are formed using conventional photoresists as a sacrificial layer on which a metal structural layer is evaporated and patterned. Structures are subsequently dry-released in an oxygen plasma. For the HPR504 and HiPR6517 photoresists, the lateral under-etching rate (power 1000 W) of about 1 μm/min was found. The presented dry-release technique is fully compatible with standard silicon IC processing and can be applied as an post-processing process module. The technique eliminates any sticking problem and simplifies the processing.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
