Abstract
In this work, the optimal characteristics of etching TiO2 films in an inductively coupled plasma system with CF4/Ar plasma were investigated. The maximum etch rate of TiO2 was 93 nm/min at fixed 200 W of inductively coupled plasma power and the highest investigated value of RF chuck power of 150 W. Using the X-ray photoelectron spectroscopy the chemical reactions between TiO2 and F were analysed. It was found that the etching mechanism included ion-stimulated desorption of reaction products on the TiO2 surface and formation of a solid solution and non-volatile TiF3.
Published Version
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