Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory

Abstract

Peridynamic (PD) theory is used to investigate the dynamic responses of electronic packages subjected to impact loading arising from drop-shock. The capability of the PD theory to predict failure is demonstrated by simulating a drop test experiment of a laboratory-type package. The failure predictions and observations are exceptionally similar. For the drop test simulation of a production-type package, the finite element method (FEM) and PD theory are coupled via a submodeling approach. The global modeling is performed using the FEM while the PD theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint, with failure at the interface between the solder and copper pad on the printed circuit board side.