Abstract
Drop test survival is a crucial element of isotropic conductive adhesive (ICA) reliability. Drop test data are presented for four different ICA materials, with varying cure profiles. Only one of the materials passes the ad hoc standard (including none of the “snap cure” formulations, although performance is improved by extended cure times). Drop test performance deteriorates when the sample has survived a series of smaller drops, leading to a cumulative damage model based on crack initiation at interface bubbles, and is improved by a pre-cure heat soak to drive off the bubbles.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
