Drive to Squeeze More Power From Tiny Packages, On-Chip Substrates Continues Unabated [From the Editor

Abstract

The fervor for miniaturization continues in the power supply world. Power supply designers have kept pace with the demands of the market for more power from smaller packages with better efficiency, reliability, and speed. While keeping the cost low. Consequently, power integration, both in package and on-chip, has continued to evolve for more than a decade. The result is that power supply in package (PSiP) and power supply on-chip (PwrSoC) have become mainstream products, driven by traditional and emerging applications. Today, we are talking about hundreds of watts from a compact semiconductor package, as well monolithic semiconductor substrates.