Abstract

Drain bias dependence of gate oxide reliability is investigated on conventional (CON) and Lateral Asymmetric Channel (LAC) MOSFETs for low drain voltages that correspond to the real operating voltages for deep-sub-micron devices. For short channel devices, the oxide reliability improves drastically as drain bias increases. Device simulations showed that the vertical field distribution in the oxide is asymmetric for non-zero drain biases and this results in an asymmetric gate current distribution with the peak at the source end. By introducing an intentionally graded doping profile along the channel (LAC), the asymmetry in the vertical filed distribution can be enhanced with consequent improvement in gate oxide reliability.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.