Abstract

Downscaling has been a focal task of Electronics and Electromechanics in the last few decades, and a great engine for technological progress as well. Nevertheless, a scaling operation affects device physics, functioning and performance. The present paper investigates about the impact of scaling on a test case compliant electrostatic micro or nano actuator that is under development with two preferred micro fabrication methods, namely, thick SOI and thin amorphous silicon. A series of numerical trials on materials strength, electro-mechanical characteristics, sensitivity and overall actuation performance have been carried out at different grades of down-scaling and of aspect ratio. This gave rise to new design charts that we propose here as a predictive and friendly guide to select the most appropriate micro fabrication method.

Highlights

  • IntroductionCharacteristic feature sizes towards increasingly smaller dimensions [1]

  • Giovine, E.; de Cesare, G.; Belfiore, In the constant search for better performances, the developments of microelectronic devices have been marked by the scaling phenomenon, consisting of pushing the devices’characteristic feature sizes towards increasingly smaller dimensions [1]

  • Mechanical Systems (MEMS) downsizing leads to significant changes in their physical behaviour, producing different outcomes with respect to their macro-scaled equivalent; the scaling itself becomes a key parameter for a microdevice to tune for a given application [23]

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Summary

Introduction

Characteristic feature sizes towards increasingly smaller dimensions [1] This enduring trend [2], together with the consequent evolution of massive low-cost and large-scale semiconductor and microelectronics technologies [3], triggered the conception and manufacturing of micromechanical structures [4], paving the way to the birth and growth of Micro Electro-Mechanical Systems (MEMS) [5,6,7,8]. MEMS can be used as extremely miniaturized sensors, actuators, microgrippers [9,10,11], with different sorts of actuation [12,13,14], piezoelectric resonators [15,16], and wave-guides [17], to only name but a few They share with microelectronic devices the same conceptual platform: processes, technologies, and facilities able to produce low-cost, large-volume fabrication steps [18,19]. MEMS downsizing leads to significant changes in their physical behaviour, producing different outcomes with respect to their macro-scaled equivalent; the scaling itself becomes a key parameter for a microdevice to tune for a given application [23]

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