Abstract
A transferable force calibration standard based on a silicon microelectromechanical sensor has been designed, fabricated, and characterized for micrometrology applications. Two essential elements of double-meander springs and full piezoresistive etched p-silicon-on-insulator Wheatstone bridges (WBs) are integrated to the sensor for enhancing the device’s sensitivity and eliminating the current leakage during an active sensing operation, respectively. The design process is supported by three-dimensional finite element modeling to select the optimal proposed sensors as well as simulating their mechanical and electrical properties in the desired force range (≤1000 μN). To fabricate the microforce sensors, a bulk micromachining technology is used by frequently involving an inductively coupled plasma deep reactive ion etching at cryogenic temperature. Several optical and electrical characterization techniques have been utilized to ensure the quality of the fabricated WBs, where their measured offset voltage can be down to 0.03±0.071 mV/V. In terms of its linearity, the fabricated device exhibits a small nonlinearity of <3%, which leads this sensor to be appropriate for precise microforce standard.
Highlights
Trends toward miniaturization require suitable fabrication technology of the systems at microscale, and reliable measurement techniques for its physical properties
We proposed a stable microforce sensor based on double-layer (DL) SOI as transferable calibration standards
These results suggest that design 1 with horizontal meander structures is superior to the other designs in terms of both stiffness and sensitivity with only relatively small standard deviation (
Summary
Trends toward miniaturization require suitable fabrication technology of the systems at microscale, and reliable measurement techniques for its physical properties. To ensure the highest quality of indentation instruments, reliable calibration procedures are still required, especially for lower force range application (i.e., systems with haptic force-feedback in minimal invasive surgery).[6] Han et al.[7] developed piezoresistive ring-shaped axial sensors to predict forces during catheterization This sensor was attached on the tip on the guidewire and its movements in z-direction led to deformation of the ring structure as well as the piezoresistive elements. Unlike the similar calibration standard, our sensor was mainly fabricated employing an inductively coupled plasma (ICP) deep reactive ion etching (DRIE) process at cryogenic temperature.[12] anisotropy of the process can be controlled and integration of meander structures into the device is feasible On both clamped ends, two piezoresistive strain gauges are used as active sensing elements. Static and dynamic properties of the devices were characterized showing promising results to broaden their industrial applications (e.g., mechanical feedback control and robotics)
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