Abstract

The rate at which individual subgrain boundaries migrate during the creep of LiF at 773 K has been measured by a double-etching technique. The migration distance increases in proportion to the creep strain. It is concluded that subgrain boundary migration contributes significantly to the recovery of subgrain boundary dislocations during creep.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call