Abstract
AbstractA focused ion beam system is applied to investigate the dose dependence of the shape of Ge channeling implantation profiles in Si and SiC at two very different dose rates (1011 and 1018 cm-2 s-1), and for implantation temperatures between room temperature and 580 °C. The competing influence of dose rate and temperature observed is explained in terms of intracascade defect relaxation. For the different implantation temperatures, the time scale for defect reduction is estimated. The results obtained for Si are compared with those for SiC.
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