Dose Measurements of Ultra-Shallow Implanted As and B in Si by RBS and ERD

Abstract

Continuous miniaturization of integrated circuits requires narrower dopant profile depth in the Si channel and consequently the use of ultra‐shallow implants in the manufacturing process. Secondary Ion Mass Spectroscopy (SIMS) is routinely used to measure the boron depth concentration profiles. However, due to the altered nature of the near‐surface sputtering process inherent to SIMS, it underestimates the B implanted doses for implantation energies below 2 keV. Alternate ion beam methods for absolute dose measurements of ultra‐shallow implanted As and B in Si are presented in this study. The dopant implant energies ranged from 250 eV, to 5 keV for boron and from 500 eV to 5 keV for arsenic. Implanted doses for both B and As varied from 2 × 1013 to 1 × 1015 atoms/cm2. The arsenic implants were studied with Rutherford Backscattering Spectrometry (RBS) using 2 MeV carbon ions. The absolute arsenic implanted doses were measured to an accuracy of better than 5%. The 1 keV arsenic implants were extensively studied for radiation damage with a 12C beam. No appreciable arsenic dose loss was observed during C irradiation for an integrated charge of ⩽ 80 μC, which was the maximum used for these studies. For the B implants, Elastic Recoil Detection (ERD) was used with 14 MeV F4+ ions. A 9.4 μm Mylar foil was found to adequately stop the scattered 19F ions and give good energy separation for the 11B recoiled ions. The absolute dose measurements are ∼ 5% for the 5 keV 11B implants. Significant radiation damage was observed for the ultra shallow implants and the measured B dose has been obtained by extrapolation to the zero integrated charge of the beam. The absolute boron dose measurements of the ultra shallow (250 eV) implants were determined with an accuracy better than 10%.