Dopant-induced excimer laser ablation of Poly(tetrafluoroethylene)

Abstract

Poly(tetrafluoroethylene) (PTFE) does not exhibit excimer laser etching behavior at conventional, e.g., single photon absorption, emissions of 193, 248, and 308 nm, due to the lack of polymer/photon interaction. This is not surprising since the electronic transitions available to the PTFE molecule are high energy and thus require short wavelength the radiation However, by incorporating a small quantity of material into the non-absorbing fluoropolymer matrix that interacts strongly with the emitted laser energy, e.g., a dopant, successful ablation, both in terms of etch rate and structuring quality occurs. Specifically, excimer laser ablation of PTFE films containing 5, 10, and 15% polyimide (wt/wt) as a dopant was achieved at 308 nm in a fluence range of 1 to 12 J/cm2. Ablation rates for the materials increased with increasing fluence and, at the polyimide levels investigated, varied inversely with dopant concentration. All compositions exhibited excellent structuring quality.