Abstract
Plated has been extensively used as the pole piece material in thin film inductive head. The interaction between stress and magnetostriction, which is a strong function of composition, has a significant effect on its domain configurations. It turns out that, from a simple analysis, the optimum film composition for poles in inductive head is quite different from that for shields in magneto‐resistive head. Factors affecting the within‐device current distribution were analyzed. The diffusion layer thickness is estimated to be around 40 μm in a plating cell with reciprocating paddle under nominal operating conditions. The trend towards narrow track width and multilayer coil head design would require more stringent composition control. Pulse plating can provide thinner diffusion layer which conforms more closely to the surface contours and thus better composition uniformity can be achieved.
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