Abstract
This study explores the influence of different fluids in a uniform micro-channel geometry on conjugate heat transfer. Nanofluids used here, are SiO2 and Al2O3 nanoparticles with various concentrations up to 4% in water as a base fluid under laminar flow. Nanofluids are compared to an ionic liquid called Butyl Methyl Imidazolium Tetrafluroborate (BMIM BF4) to examine the influence of heat transfer and fluid flow characteristics. Good agreement was found against previous micro-channel studies, numerical simulations with COMSOL Multiphysics® V5.2a are used at Reynolds number ranging from 50 to1000 with a uniform heat flux of 100 W/cm2 relevent to cooling systems. Advanced fluids might offer significant potential in combatting the challenges of heat transfer in the technological drive toward lower weight/smaller volume electrical and electronic devices. The results show that the lowest thermal resistance is for nanofluids followed by water, then the ionic liquid. Moreover, Al2O3-water offers lower thermal resistance than the SiO2-water for all given nanoparticle concentrations. It is also found that there is no beneficial using ionic liquids in forced convection systems which work below boiling temperature conditions.
Highlights
Micro-processor cooling systems are gradually becoming a wide area of interest for thermal system researchers due to the rapid development of size shrinking and reduced weight in electronic devices, with the consequence of higher heat generation in limited cross-sectional areas
The influence of different effects on thermal resistance can be seen in Fig. 1, the effect of nanoparticles concentration up to 4% of the Al2O3 and SiO2 nanoparticles in water with the pure water and ionic liquid in a uniform micro-channel
The results showed that the highest pressure penalty is for the ionic liquid, followed by nanofluids with high concentrations, while the lowest pressure drop is for water
Summary
Micro-processor cooling systems are gradually becoming a wide area of interest for thermal system researchers due to the rapid development of size shrinking and reduced weight in electronic devices, with the consequence of higher heat generation in limited cross-sectional areas. This brings to fore the need to eliminate the generated heat as it could adversely affect the electronic chip. Ionic Liuids (ILs) are molten salts which are available at liquid phase under room standard conditions These salts attracted many researchers due to their promising properties such as their low volatility, exhibit high thermal stability and their physical properties can be controlled by changing their chemistry [11]. The aim of this paper is mainly to suggest using ILs as coolants in various heat exchanging duties under extreme conditions and to compare between one IL with various nanofluids and water when they are employed as coolants for cooling electronic systems
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