Distributed axis electron beam technology for maskless lithography and defect inspection

Abstract

The limitations to the throughput of electron beam systems employing a single axis are now well known. Accordingly there is increased activity in the exploration of multiaxis systems. The approach described here features both common focusing and common deflection, thus simplifying the problem of pattern stitching. Another feature, thought by some to be a disadvantage, is that the imaging is at unity magnification. We have designed and built a test stand that presently features one axis (or beamlet) in a large homogeneous magnetic field so that the extension to multiple axes can be seen to be straightforward. With this arrangement we have demonstrated that the resolution can be at least in the 30–50 nm range, that operation at low voltage (down to 260 V) is possible, that we can operate using multiple axes, and that secondary electrons generated by one beamlet can be confined so that it is possible to use this arrangement for high-speed inspection.