Abstract
Significant distortion can originate during the bonding process, resulting in overlay issues for final backside illumination image sensor wafer processing, impacting final wafer yield and device reliability. This paper presents a distortion free bonding process where the bonding initiation is controlled by low gas pressure. No external force is needed to initiate the bonding. The resulting overlay capability enables the backside illumination image sensor technical roadmap. In addition, a wafer shape analysis methodology developed for early distortion detection is discussed, allowing bonding process optimization and diagnostic for bonding rework.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
