Abstract
The resin dissolution process was conducted successfully in full-scale equipment at the SRL Semiworks. A solution containing 0.001M Fe/sup 2 +/, or Fe/sup 3 +/, and 3 vol % H/sub 2/O/sub 2/ in 0.1M HNO/sub 3/ is sufficient to dissolve up to 40 vol % resin slurry (Dowex 50W-X8). Foaming and pressurization can be eliminated by maintaining the dissolution temperature below 99/sup 0/C. The recommended dissolution temperature range is 85 to 90/sup 0/C. Premixing hydrogen peroxide with all reactants will not create a safety hazard, but operating with a continual feed of hydrogen peroxide is recommended to control the dissolution rate. An air sparging rate of 1.0 to 1.5 scfm will provide sufficient mixing. Spent resin from chemical separation contains DTPA (diethylenetriaminepentaacetic acid) residue, and the resin must be washed with 0.1M NH/sub 4/ OH to remove excess DTPA before dissolution. Gamma irradiation of resin up to 4 kW-hr/L did not change the dissolution rate significantly.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
