Dissolution behaviour of Ti/Cu contact reaction

Abstract

This paper investigates the base metal dissolution behaviour of Ti/Cu contact reaction couples at temperatures of 880–940°C and holding times of 1–180 s. The results show that once the temperature reached the eutectic point of Ti and Cu (875°C), the liquid formed quickly. For Ti/Cu contact reaction couples, the formation of eutectic liquid phase had a direction affected by the contact assembly, i.e. the eutectic liquid phase formed first at the Cu side, and then spread along the depth direction of Cu. The width of the eutectic liquid zone when Ti was placed on Cu was wider than when Ti was placed under Cu. Also, the shape of the upper liquid zone was wave-like while the shape of the lower liquid zone was planar, the formation mechanisms of the two liquid zone are related to the spreading behaviour of the eutectic liquid at the Ti/Cu interface. The formation process of Ti/Cu eutectic liquid zone was similar to that of the traditional solid-state diffusion zone, and the relationship between the width of the liquid zone and holding time obeyed a square root law.