Abstract
In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.
Highlights
Microelectromechanical systems (MEMS) are used to create miniature, highly sensitive sensors and actuators that can collect non-electronic information from the physical world such as temperature, barometric pressure, relative humidity, acceleration, vibration [1, 2]
Displacements were performed for the gold device instead of gold material for similar input potentials
An observation was made on the amount of displacement that occurs by passing a current through the device
Summary
Microelectromechanical systems (MEMS) are used to create miniature, highly sensitive sensors and actuators that can collect non-electronic information from the physical world such as temperature, barometric pressure, relative humidity, acceleration, vibration [1, 2]. This analog information can be digitized and transmitted to a microcontroller for signal processing. The manufacturing of the MEMS device uses the semiconductor manufacturing process that includes surface micro-processing and batch microprocessing, which can be compatible with an integrated circuit [5]. These devices or systems are capable of sensing, controlling, actuating, and creating macro-scale effects on a micro-scale [6,7,8]
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