Abstract
A process was developed to incorporate stable dispersed acrylate rubber particles in an epoxy resin matrix which greatly reduces the stress of cured epoxy resins for electronic encapsulation application. The effect of the alkyl group of the acrylate monomer on the phase separation of resultant elastomers from epoxy resin was investigated. The dispersed acrylate rubbers effectively reduce the stress of cured epoxy resins by reducing the flexural modulus, while the glass transition temperature (Tg) was hardly depressed. Electronic devices encapsulated with the dispersed acrylate rubber-modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and resulted in an extended device use life.
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