Abstract
This paper investigated the design of dismantlable polyurethane adhesives and dismantling method. To study the dismantlement property of dismantlable polyurethane adhesive by controlling thermal property, we synthesized polyurethane adhesive with various hard segment contents and used thermally expansive microcapsules. The dismantlement of bonded adherend was caused by the expansion of the adhesive layer with the expansion of the thermally expansive microcapsule and softening of the adhesive. For the dismantlement of bonded adherend, the adhesive is needed to have low storage modulus at the expansion temperature of thermally expansive microcapsule. High storage modulus of the adhesive was good for the bonding strength but not for dismantlability. In our study, the dismantlability became better as the hard segment content of adhesive decreased and the bonding strength and heat-resistance were excellent when the hard segment content was more than 25% because of high storage modulus and physical property. Consequently, optimum hard segment content was 25%, which showed excellent adhesion strength and dismantlement of bonded adherend was possible with microwave treatment for 4 min. Using zinc oxide with high dielectric constant could shorten microwave treatment time needed for the dismantlement of the bonded adherend to 3 min by enhancing the heating efficiency of the adhesive.
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