Dislocation densities in copper single crystals after thermal treatment

Abstract

AbstractCopper crystals of high purity and doped with nickel were subjected to a long time thermal treatment at 1050°C, in order to reduce the as‐grown dislocation density of about 107 cm−2. A dissolution of the dislocations during their motion to the crystal surface was observed. Regions of different dislocation densities arose. Finally the crystals exhibited constant dislocation densities of 102 cm−2. Such a perfection or a better one of the crystals is reached only by a long time treatment, since the dislocation velocity without external stresses cannot exceed 1 · 10−7 cm · s−1 in copper single crystals of high purity.