Abstract
The dislocation distribution in tantalum foil after fatigue testing in the region of the yield point has been determined quantitatively using thin film electron microscopy. Changes in the measured microstructural parameters as a function of stress level, test temperature, and number of loading cycles have been related to a microscopic model of the fatigue process. The model leads to a consistent criterion for fatigue failure based on the gradual growth of impenetrable subboundary groups of immobile dislocation.
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