Abstract
AbstractThe use of polymeric thin film as a substrate material in fabrication of flexible organic light‐emitting diodes (OLEDs) devices is well known. Polyethylene terephthalate (PET) and polyethylene naphtalate (PEN) thin films are used for such purpose commercially. In the present work, 10g of disentangled ultrahigh molecular weight polyethylene (D‐UHMWPE) was processed into 35 ± 5μ thin film by continuous solid state compaction process between two heated rollers of roll mill. The temperature of both rollers was kept at 125°C as well as 128°C and the thin‐film production rate was 1.5 m/min. Subsequently film was studied for substrate application in fabrication of flexible OLEDs. The primary requirement of OLED substrate material namely chemical stability, transparency, and dimensional stability of D‐UHMWPE thin film were studied. D‐UHMWPE film showed excellent chemical stability under various solvents (chloroform, chlorobenzene, dichlorobenzene, acetone, and isopropanol) treatments along with >80% transparency and dimensional stability up to 100 ± 10°C (machine and transverse directions 0.001% and 0% at 90°C and 0.003% and 0% at 110°C). Finally, OLED device was fabricated on D‐UHMWPE surface which showed excellent performance in terms of (light emitting) even when the devices were bended.
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