Abstract

This article first analyzes the verification of Xinyan electronic components, including functional verification, performance verification, and process verification. Secondly, the author elaborated on the current status of use of the newly developed electronic component verification methods, such as low applicability of domestic components, poor authority of verification specifications, and low integration of development and application. This paper studies the overall verification process analysis, application verification method analysis, verification effect evaluation analysis, verification information sharing evaluation, etc., in order to improve the accuracy of verification results and the rationality of electronic components distribution.

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