Abstract
In this study, we investigate a new synthetic route, termed the solution plasma process, for the synthesis of colloidal copper nanoparticles (CuNPs) in the presence of an amide and acid capping agent. Gelatin and ascorbic acid were selected as the capping agents to protect the particles against coalescence and oxidation side reaction. Using a high voltage power supply, CuNPs were rapidly formed by 1 min after the discharge. The size and shape of the CuNPs were dependent on the discharge time and were clearly influenced by the effect of the capping agents under two characteristics of the discharge medium (pH and temperature). With a long discharge time, the CuNP size tended to decrease with the formation of anisotropic particle morphologies: spherical, cubic, hexagonal, triangular and rod-like shapes. The decrease in CuNP size as a function of discharge time could be explained by the dissolution of CuNPs in a lower pH solution. After 5 min discharge the capping agent evidently allowed the protection of the synthesized CuNPs against oxidation with the presence of anisotropic CuNP shapes. It is demonstrated that the CuNP shape could be tuned from spherical to anisotropic shapes without the undesirable oxidation by adjusting the discharge time of the solution plasma. These advantages are valuable for material engineering to design the properties of Cu-based nanoparticles for the desired applications.
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