Abstract
Consumer electronic products have a complex life cycle, characterized by environmental, social, and economic impacts and benefits associated with their manufacturing, use, and disposal at end-of-life. Accurately analysing these trade-offs and creating sustainable solutions requires data about the materials and components that make up these devices. Such information is rarely disclosed by manufacturers and only exists in the open literature in disparate case study format. This study presents a comprehensive database of bill of material (BOM) data describing the mass of major materials and components contained in 95 unique consumer electronic products. Data are generated by product disassembly and physical characterization and then validated against external benchmarks in the literature. The study also contributes a reproducible framework for organizing BOM data so that they can be expanded as new products enter the market. These data will benefit researchers studying all aspects of electronics and sustainability, including material scarcity, product design, environmental life cycle assessment, electronic waste policy, and environmental health and safety.
Highlights
Background & SummaryConsumer electronics have enabled a revolution in the way society accesses and shares information, education, and entertainment
The ability to research and create sustainable solutions for electronic products hinges on the availability of high-quality data that accurately capture the materials and components contained in these devices
These tools are typically applied to specific case study electronic products[1,8], which makes it challenging to generalize to other product types, designs, or time periods
Summary
Background & SummaryConsumer electronics have enabled a revolution in the way society accesses and shares information, education, and entertainment. This study was carried out to collect, verify, and disseminate BOM data that describe the major materials and components contained in common consumer electronic products.
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