Direct-write fabrication of integrated, multilayer ceramic components

Abstract

The need for advanced (electronic) ceramic components with smaller size, greater functionality, and enhanced reliability requires the ability to integrate electronic ceramics in complex 3-D architectures. However, traditional tape casting and screen printing approaches are poorly suited to the requirements of rapid prototyping and small-lot manufacturing. To address this need, we are developing a direct-write approach for fabricating highly integrated, multilayer components using a micropen to deposit slurries in precise patterns. This approach provides the ability to fabricate multifunctional, multimaterial integrated ceramic components (MMICCs) in an agile and rapid way, and has been used to make integrated passive devices such RC filters, inductors, and voltage transformers.