Abstract
Kinetically controlled transfer printing based on rate-dependent adhesion is widely used to heterogeneously integrate micro/nano-devices. Through analysis of peeling stamps with grating-like micropatterns from the rigid substrate in different directions, the directionally dependent adhesion strength is investigated in detail. Experiments of peel test and picking up silicon ribbons from silicon-on-insulator wafer were conducted and consistent with the analytical prediction. The method and analytical results proposed in this Letter can guide the design of the micropatterns on stamp to realize a more effective transfer printing approach.
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