Abstract
Directly written circuits on polymeric housings can reduce weight and enhance flexibility due to the wiring of electronic devices and systems in automotive and aerospace parts. These circuits must conform to a variety of geometries while maintaining electrical conductivity after deformations. To address these challenges, a hybrid copper-based ink has been developed capable of self-healing. Low melting temperature metals such as indium can work as a self-healing agent in response to deformational processes such as thermoforming. A new generation of devices is conceptualized utilizing printable hybrid copper-based ink, sintered and healed within a few milliseconds via intense pulsed light (IPL).
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