Abstract
Metal oxide thin films for soft and flexible electronics require low cost, room temperature fabrication, and structuring processes. We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry, including resistors, capacitors, field-effect transistors, diodes, rectifiers, and memristors directly on imperceptible plastic substrates. Largely independent on surface properties, we achieve high-quality, few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope. We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4 µF cm−2. Applicable to the whole class of valve metals and their alloys, our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.
Highlights
Fabrication of plastic oxide electronics relies on vacuum deposition of oxides through atomic layer deposition (ALD), molecular beam epitaxy, and sputtering, where remarkable achievements have been made, from single components to working demonstrators.[30,31,32,33,34]
The oxides of valve metals like titanium, hafnium, tungsten, and tantalum are used for resistive memories,[35,36] electrochromic devices,[37,38,39] and electronic components.[40,41]
We exploit a custom made scanning droplet cell microscope (SDCM) as anodic printing head for direct fabrication of metal oxide structures from valve metals
Summary
The accelerating metamorphosis of bulky-in-origin electronics to a flexible, lightweight, and even soft, biomimetic embodiment is changing our perception of technology.[1,2,3,4,5,6,7] Applications of soft electronics are expanding rapidly, ranging from consumer devices[8,9] to soft robotics[10,11,12] and bioelectronic interfaces.[13,14,15] This change in paradigm demands forming and patterning of dielectrics and semiconductors in thin-film devices in ways that are compatible with low-cost, room temperature fabrication.[16]. Christian Michael Siket[1,2], Nadine Tillner[1], Andrei Ionut Mardare[3,4], Amir Reuveny[2], Carina Daniela Grill[3], Florian Hartmann[5], Gerald Kettlgruber[1], Richard Moser[1], Jan Philipp Kollender[3], Takao Someya 2, Achim Walter Hassel[3,4], Martin Kaltenbrunner[5] and Siegfried Bauer[1]
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