Abstract

The next generation optical, electronic, biological, and sensing devices as well as platforms will inevitably extend their architecture into the 3rd dimension to enhance functionality. In focused ion beam induced deposition (FIBID), a helium gas field ion source can be used with an organometallic precursor gas to fabricate nanoscale structures in 3D with high-precision and smaller critical dimensions than focused electron beam induced deposition (FEBID), traditional liquid metal source FIBID, or other additive manufacturing technology. In this work, we report the effect of beam current, dwell time, and pixel pitch on the resultant segment and angle growth for nanoscale 3D mesh objects. We note subtle beam heating effects, which impact the segment angle and the feature size. Additionally, we investigate the competition of material deposition and sputtering during the 3D FIBID process, with helium ion microscopy experiments and Monte Carlo simulations. Our results show complex 3D mesh structures measuring ~300 nm in the largest dimension, with individual features as small as 16 nm at full width half maximum (FWHM). These assemblies can be completed in minutes, with the underlying fabrication technology compatible with existing lithographic techniques, suggesting a higher-throughput pathway to integrating FIBID with established nanofabrication techniques.

Highlights

  • Design, high precision placement, and high throughput of 3D conductive and insulating nanostructures is attractive for many fields

  • We explore beam heating effects and the interplay of deposition and milling, which occurs as matter interacts with an accelerated ion beam in focused ion beam induced deposition (FIBID) of free-standing structures by mapping deposition and milling regimes as a function of beam pitch and dwell time

  • The size, deposition rate, and composition of the helium ion microscopy (HIM) FIBID structures with the MeCpPtMe3 precursor depend on many parameters

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Summary

Introduction

High precision placement, and high throughput of 3D conductive and insulating nanostructures is attractive for many fields. Recent advances in the bottom-up design of 3D features include two-photon lithography, focused-electron-beam-induced deposition, and gallium ion beam irradiation [7,8,9,10].

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